This video eBook helps establish foundations for designing and characterizing the electrical properties of interconnects to explain in a simplified way how signals propagate and interact with interconnects and how the physical design of transmission structures will impact performance. The tools of time- and frequency-domain measurement, two- and three-dimensional field solvers, transmission-line simulations, circuit simulators, and analytical approximations are introduced to build verified equivalent circuit models for packages and interconnects.
Amendra Koul added it Aug 01, Professor Eric Bogatin also provides a website to help educate the engineering community on this topic bethesignal. I have two parts for this review. If signal integrity is not taken into account from the beginning, there is little hope a design will work the first time. The rest of the book describes how the circuit models of interconnects affect the electrical performance of the system in terms of the four families of noise problems: Differential Pairs and Differential Impedance Chapter Today, in a high-speed digital system with a clock frequency above about MHz, it is the real wires—the wire bonds, the package leads, the pins, the circuit board traces, the connectors, and the cabling—that create signal-integrity problems and can prevent products from working correctly the first time.
Rather, it is an understanding of the mechanisms, principles and definitions, and exposure to the possibilities, that contribute to the creation of a solution. Selected References Appendix D. In the last five erkc, a whole new generation of tools has become available.
With modern digital electronic systems pushing beyond the 1-GHz barrier, packaging and board designers must now balance signal integrity and electrical performance with these other concerns.
The Physical Basis of Inductance 6. What Is Inductance? Self-Inductance and Mutual Inductance 6. Partial Inductance 6. Loop Self- and Mutual Inductance 6. Loop Inductance per Square of Planes 6. Loop Inductance of Planes and Via Contacts 6. Loop Mutual Inductance 6. Equivalent Inductance 6. Summary of Inductance 6. Current Distributions and Skin Depth 6. High-Permeability Materials 6. Eddy Currents 6. The Bottom Line 7.
The Physical Basis of Transmission Lines 7. Forget the Word Ground 7. The Signal 7. Uniform Transmission Lines 7. The Speed of Electrons in Copper 7. The Speed of a Signal in a Transmission Line 7. Spatial Extent of the Leading Edge 7. The Instantaneous Impedance of a Transmission Line 7. Characteristic Impedance and Controlled Impedance 7. Famous Characteristic Impedances 7. The Impedance of a Transmission Line 7. Driving a Transmission Line 7. Return Paths 7.
Calculating Characteristic Impedance with Approximations 7. An n-Section Lumped Circuit Model 7. Frequency Variation of the Characteristic Impedance 7. The Bottom Line 8. Transmission Lines and Reflections 8.
Reflections at Impedance Changes 8. Why Are There Reflections? Reflections from Resistive Loads 8. Source Impedance 8. Bounce Diagrams 8.
Simulating Reflected Waveforms 8. Measuring Reflections with a TDR 8. Transmission Lines and Unintentional Discontinuities 8. When to Terminate 8. Reflections from Short Series Transmission Lines 8. Reflections from Short-Stub Transmission Lines 8. Reflections from Capacitive End Terminations 8. Reflections from Capacitive Loads in the Middle of a Trace 8. Capacitive Delay Adders 8.
Effects of Corners and Vias 8. Loaded Lines 8. Author : Mark I. Author : Clayton R. This book is meant to repair that basic deficiency. Author : Eugene R. Author : Djafar K. Understanding Signal Integrity.
Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method.
Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are being challenged to develop sophisticated analog solutions.
This comprehensive source book of circuit design solutions aids engineers with elegant and practical design techniques that focus on common analog challenges. This is the companion volume to the successful Analog Circuit Design: A Tutorial Guide to Applications and Solutions October , which has sold over copies in its the first 6 months of since publication. It extends the Linear Technology collection of application notes, which provides analog experts with a full collection of reference designs and problem solving insights to apply to their own engineering challenges Full support package including online resources LTSpice Contents include more application notes on power management, and data conversion and signal conditioning circuit solutions, plus an invaluable circuit collection of reference designs.
The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package.
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